SemiAnalysis Lab Teardown Details SMIC 7nm Technology and Huawei Kirin 9030
SemiAnalysis has launched its new in-house chip teardown lab, publishing its first analysis. The initial teardown focused on SMIC’s third-generation 7nm technology, specifically identifying its minimum local metal pitch at 32.5nm. The Huawei HiSilicon Kirin 9030 chip, described as "sanctions-beating," was the first subject of the new lab's detailed examination.
SemiAnalysis has inaugurated its new in-house chip teardown laboratory, releasing the findings of its initial analysis. The first teardown concentrated on the characteristics of SMIC’s third-generation 7nm technology.
During the analysis, SemiAnalysis identified the minimum local metal pitch on SMIC’s 7nm process as 32.5nm. This measurement was compared to Intel's 18A process, where SMIC's 7nm metal pitch was found to surpass it. However, the report also indicated that SMIC's 7nm technology lags behind Intel 18A by 38% in terms of density.
The Huawei HiSilicon Kirin 9030 chip, which has been described as "sanctions-beating," served as the initial subject for examination within SemiAnalysis's newly established lab.
According to Tom's Hardware, these findings represent the first public output from the new SemiAnalysis teardown facility.
